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The most efficient connecting technology
Bond any metallic or metallized surface
Breakthrough value propositions
Germany based, award winning company
90+ patents
Company-owned technology centers in Europe and Asia
The most efficient connecting technology
Bond any metallic or metallized surface
Breakthrough value propositions
Germany based, award winning company
50+ patents
Company-owned technology centers in Europe and Asia

NanoWired Connection Technologies

We research and develop substitution of solder, silver/copper sintering, TLPS, brazing, thermal connections, busbars.

View Technology Overview
NanoWiring is a galvanic process similar to pad printing. It is possible to produce the nanowires from practically all metals that can be galvanically deposited (copper, gold, silver, nickel, etc.).
KlettSintering connects two substrates, only one of which has been prepared using NanoWiring. KlettSintering achieves significantly higher tensile and shear strengths than KlettWelding.
In KlettWelding, two substrates prepared by NanoWiring are joined by pressing them together at room temperature. The obtained bond has superior electrical and thermal characteristics.
KlettGlueing connects two substrates, only one surface has NanoWiring structure. Adhesive is applied before low pressure and low temperature compression. Suitable for sensitive devices.

NanoWired High Performance Applications

3D Packaging
3D Packaging
Die/Substrate Attach
Die/Substrate Attach
Wire Bonding Replacement / FPC
Wire Bonding Replacement / FPC
Complete Power Module Solutions
Complete Power Module Solutions
TIM
TIM
And More
And More
ADVANCED TECHNOLOGY

Discover a Way to Manufacture
200°C Power Module

No Printing/Dispensing.
No Drying/Cleaning.
Low temperature process.
No CTE mismatch.
Top/bottom interconnection in one step.
Learn more
MADE BY NANOWIRED TEAM

NanoWired presents the unique, patented NanoWiring Cube!

Original NanoWiring in your facility!

Applications
Demo Video
Leadframe
Automated Process

Leadframe

Discover all applications
Wafer
Automated Process

Wafer

Discover all applications
DBC/PCB
Automated Process

DBC/PCB

Discover all applications

Fully automatic process.
Intelligent drawer to placing the substrate.
Integrated touch display.
Production area 400*300 mm.
Max substrate height 120 mm.
Image

NANOWIRED MANAGEMENT

Board of Directors

Olav Birlem
Olav Birlem
Chief Executive Officer
Dr. Sebastian Quednau
Dr. Sebastian Quednau
Chief Science Officer
Dr. Klaus Radermacher
Dr. Klaus Radermacher
Chief Technology Officer
Get to know our team!
MADE BY NANOWIRED TEAM

Get News and Updates
from our team of experts

News & Updates
Meet Us at Nepcon Japan 2023 (Tokyo)
Event
Meet Us at Nepcon Japan 2023 (Tokyo)
 January 17, 2023
Winner of the TIE Award 2022
Announcement
Winner of the TIE Award 2022
 October 21, 2022
Winner of the Falling Walls Venture Award 2020
Uncategorized
Winner of the Falling Walls Venture Award 2020
 November 6, 2020

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