The most efficient connecting technology
Bond any metallic or metallized surface
Breakthrough value propositions
Germany based, award winning company
Company-owned technology centers in Europe and Asia
NanoWired Connection Technologies
We research and develop substitution of solder, silver/copper sintering, TLPS, brazing, thermal connections, busbars.
Discover a Way to Manufacture200°C Power Module
Low temperature process.
No CTE mismatch.
Top/bottom interconnection in one step.
MADE BY NANOWIRED TEAM
NanoWired presents the unique, patented NanoWiring Cube!
Original NanoWiring in your facility!
Fully automatic process.
Intelligent drawer to placing the substrate.
Integrated touch display.
Production area 400*300 mm.
Max substrate height 120 mm.