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NANOWIRED PARTNERS
CONNECTION TECHNOLOGY
Overview of NanowiredConnection Technologies
We research and develop substitution of solder, silver/copper sintering, TLPS, brazing, thermal connections, busbars.
NanoWiring is a galvanic process similar to pad printing. It is possible to produce the nanowires from practically all metals that can be galvanically deposited (copper, gold, silver, nickel, etc.).
In KlettWelding, two substrates prepared by NanoWiring are joined by pressing them together at room temperature. The obtained bond has superior electrical and thermal characteristics.
KlettSintering connects two substrates, only one of which has been prepared using NanoWiring. KlettSintering achieves significantly higher tensile and shear strengths than KlettWelding.
KlettGlueing connects two substrates, only one surface has NanoWiring structure. Adhesive is applied before low pressure and low temperature compression. Suitable for sensitive devices.
NANOWIRED APPLICATIONS
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MADE BY NANOWIRED TEAM
NanoWired GmbH Presents NanoWiring Cube!
NANOWIRED MANAGEMENT
Board of Directors
The combination of 7 years of research at the Technical University of Darmstadt and many years of management experience in industry laid the foundation for the founding of NanoWired GmbH. In the meantime, a highly motivated team, including members from the fields of chemistry and material sciences, is driving the technology of NanoWired GmbH forward on a daily basis.
Olav Birlem
Chief Executive Officer
Dr. Sebastian Quednau
Chief Science Officer
