Power Module
Easy Process
Single Step Assembly Available
Superior Thermal Cycling Capability
![Stack](https://nanowired.de/wp-content/uploads/power-module-main-4.webp)
![Stack](https://nanowired.de/wp-content/uploads/power-module-main-4.webp)
ASSEMBLY PROCESS - METHOD 1
Single Step Assembly Power Module
NanoWiring on Wafer
NanoWiring on FPC
Cleaning DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
![](https://nanowired.de/wp-content/uploads/power-module-process.webp)
ASSEMBLY PROCESS - METHOD 2
Single Step Assembly Power Module
Wafer Cleaning
NanoWiring on FPC
NanoWiring on DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
![](https://nanowired.de/wp-content/uploads/power-module-process-2.webp)
ADVANCED TECHNOLOGY
Process Advantages
0 min
Offline: NanoWiring
0 s
Inline: Pick and Place
<0 sec
KlettSintering at 180°C
Fast Process
● Single Step Assembly
● KlettWelding Tape available as Preform
● KlettWelding Tape available as Preform
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
● No Drying
● No Cleaning
No CTE Mismatch
DCB Copper and Interconnection copper have same CTE
No Silver Migration
Copper has no electromigration issue
![](https://nanowired.de/wp-content/uploads/power-module-main-4.webp)
![](https://nanowired.de/wp-content/uploads/power-module-adv-2.webp)
![](https://nanowired.de/wp-content/uploads/power-module-adv-6.webp)