Power Module

Easy Process
Single Step Assembly Available
Superior Thermal Cycling Capability
Stack
Stack
ASSEMBLY PROCESS - METHOD 1

Single Step Assembly Power Module

NanoWiring on Wafer
NanoWiring on FPC
Cleaning DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
ASSEMBLY PROCESS - METHOD 2

Single Step Assembly Power Module

Wafer Cleaning
NanoWiring on FPC
NanoWiring on DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
ADVANCED TECHNOLOGY

Process Advantages

0 min

Offline: NanoWiring

0 s

Inline: Pick and Place

<0 sec

KlettSintering at 180°C
Fast Process
● Single Step Assembly
● KlettWelding Tape available as Preform
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
No CTE Mismatch
DCB Copper and Interconnection copper have same CTE
No Silver Migration
Copper has no electromigration issue

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