KlettWelding
KLETTWELDING PROCESS
Structuring
Coating
Both surfaces have a NanoWiring structure
Positioning
Compressing
Room temperature
Pressure from 15 MPa
Time from 60 ms
KLETTWELDING OVERVIEW
Watch video about KlettWelding presented by our CEO
KLETTWELDING+ PROCESS
Structuring
Coating
Both surfaces have a NanoWiring structure
Positioning
Compressing
From 170°C
Pressure from 10 MPa
Time from 10 s
The following tables shows the comparison between KlettWelding and KlettWelding+ connection technologies
KlettWelding
KlettWelding+
Both Sides
Both Sides
20
170...240
From 15
From 10
0.06...60
120...300
6...20
20...65
Very fast
Very fine pitch
Low temperature
Very fine pitch
Low temperature
Very fine pitch
Very high shear strength
Very high shear strength
Die Attach
Flip Chip
Temperature sensitive devices
Flip Chip
Temperature sensitive devices
Die Attach
Flip Chip
High current busbar
Flip Chip
High current busbar