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KlettGlueing

Connection for sensitive parts
Low binding force
Low temperature process
A surface has a NanoWiring structure
Use of low viscosity adhesive
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KLETTGLUEING PROCESS

How We Manufacture KlettGlueing

Structuring
Coating

One surface has a NanoWiring structure

Positioning

Applying adhesive

Compressing

Low temperature
Pressure from 1 MPa
Time from 60 ms

KLETTGLUEING OVERVIEW

KlettGlueing Applications

Assembly joints - FPC/PCB, PCB/PCB
Temperature sensitive devices
Fragile equipment

KlettGlueing Video Tutorial

Watch video about KlettGlueing presented by our CEO

KLETTGLUEING+ PROCESS

KlettGlueing+ Features

Lowest preparation effort
Low binding forces
Repairable

KlettGlueing+ Applications

Assembly joints - FPC/PCB, PCB/PCB
Temperature sensitive devices
Fragile equipment
Prototypes
Connection repair

How We Manufacture KlettGlueing+

Structuring
Coating

No surface has a NanoWiring structure

Positioning

Apply adhesive

Compressing

Low temperature
Pressure from 1 MPa
Time from 60 ms

Comparison of NanoWired connection technologies

The following table shows the comparison between KlettWelding and KlettWelding+

Comparison Table
KlettGlueing
KlettGlueing+
NanoWiring
one side + adhesive
KlettWelding Tape + adhesive
Process Temperature (°C)
20...150
20...150
Process Pressure (MPa)
1...5
1...5
Process Time (s)
0.06...300
0.06...300
Shear strength (MPa)
approx. 20
approx. 20
Main Advantage
- Low temperature
- Low pressure
- Only one NW level
- Very fine pitch
- Low temperature
- Low pressure
- No NW level
Typical Application
- FPC/PCB, PCB/PCB
- Temperature sensitive devices
- Fragile equipment
- FPC/PCB, PCB/PCB
- Temperature sensitive devices
- Fragile equipment
- Prototypes
- Connection repair

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