KlettSintering
KLETTSINTERING过程
结构化
涂层
只有一个表面有NanoWiring结构
定位
施加压力
温度 （从170°C）
压力 （从10 MPa）
时间 （从10 s）
KLETTSINTERING OVERVIEW
Watch video about KlettSintering presented by our CEO
KLETTSINTERING+ PROCESS
Structuring
Coating
No surface has NanoWiring structure
Positioning
Compressing
From 170°C
Pressure from 10 MPa
Time from 120 s
The following tables shows the comparison between KlettSintering and KlettSintering+ connection technologies.
KlettSintering
KlettSintering+
One Side
KlettWelding Tape
170...240
170...240
10...30
10...30
120...300
120...300
20...50
30...60
High shear strength
Very fine pitch
Only one NW level
Very fine pitch
Only one NW level
No NW stage
High shear strength
High shear strength
Die Attach
Flip Chip
Flip Chip
Die Attach
Flip Chip
High current busbar
Flip Chip
High current busbar