KlettSintering

Robust substrates, strong connection
Most cost-effective method
Only one surfaces have a NanoWiring structure
Shear strength up to 55 MPa
Significantly higher tensile strength than KlettWelding
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KLETTSINTERING PROCESS

How We Manufacture KlettSintering

Structuring
Coating

One surface has a NanoWiring structure

Positioning
Compressing

From 170°C
Pressure from 10 MPa
Time from 10 s

KLETTSINTERING OVERVIEW

KlettSintering Applications

Automotive busbar Power transport by car/plane/truck
Housing technology
Power Electronics / Die Attach
Contact link
Ceramics on metal (e.g. sensors)

KlettSintering Video Tutorial

Watch video about KlettSintering presented by our CEO

KLETTSINTERING+ PROCESS

KlettSintering+

Minimum preparation effort
No surface has NanoWiring structure
Use of KlettWelding Tape
High-strength, repairable

KlettSintering+ Applications

Highest flexibility application
High current busbars
3D electronics

How We Manufacture KlettSintering+

Structuring
Coating

No surface has NanoWiring structure

Positioning
Compressing

From 170°C
Pressure from 10 MPa
Time from 120 s

Comparison of NanoWired connection technologies

The following tables shows the comparison between KlettSintering and KlettSintering+ connection technologies.

Comparison Table
KlettSintering
KlettSintering+
NanoWiring
one side
KlettWelding Tape
Process Temperature (°C)
170...240
170...240
Process Pressure (MPa)
10...100
10...100
Process Time (s)
120...300
120...300
Shear strength (MPa)
20...50
20...55
Main Advantage
- High shear strength
- Very fine pitch
- Only one NW level
- No NW stage
- High shear strength
Typical Application
- Die Attach
- Flip Chip
- Die Attach
- Flip Chip
- High current busbar

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