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2d/3d packaging

2D/3D Packaging

Stress-free joining of thin film wafers

Bonding of Hybrid systems

High mechanical unevenness is tolerated

Revolutionizing Semiconductor Design

Chiplets are becoming increasingly important as they allow flexible combination of specialized semiconductor

Our Technology

Fine-pitch interconnects (5–10 µm) for chiplet stacking and 2.5D/3D ICs

1st-level interconnects (40–50 µm) with excellent thermal and electrical performance

2nd-level interconnects (>150 µm) for integration into conventional PCB designs

Scalable Solution

Industrially scalable interconnect architecture

Coverage across the full packaging stack

Ultra-fine pitch interconnect capability

Seamless chip-to-system level integration

die substrate

Die Attach / Substrate Attach

Substitution Solder/Sintering/TLPS

Mechanical Joint Strength

High Reliability in Active Power Cycling

Revolutionizing Sintering Materials

NanoWiring and NanoWiring Preform are cutting-edge sintering materials

Creates a robust, highly reliable joint with superior thermal conductivity.

Eco-friendly, free of lead, halogens, organic fillers and nanoparticles.

Simplified Process with Minimal Steps

No printing, dispensing and predrying steps

Simple pick and place process

Low sintering parameters

No cleaning required