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Die Attach / Substrate Attach

Substitution Solder/Sintering/TLPS
Mechanical Joint Strength
High Reliability in Active Power Cycling
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Revolutionizing Sintering Materials

NanoWiring and NanoWiring Preform are cutting-edge sintering materials
Creates a robust, highly reliable joint with superior thermal conductivity.
Eco-friendly, free of lead, halogens, organic fillers and nanoparticles.

Simplified Process with Minimal Steps

No printing, dispensing and predrying steps
Simple pick and place process
Low sintering parameters
No cleaning required
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ASSEMBLY PROCESS

NanoWired KlettWelding Die Attach Process Flow

ADVANCED TECHNOLOGY

Process Advantages

0 sec

Fast Process

0°C

Low Temperature Process

0 MPa

Die Shear Strength
Fast Process
● Process could be done under 1 minute
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
Filling Up Irregularities
NanoWired compensates for irregularities of substrate surfaces
Excellent Bond Properties
● Die shear strength 50 MPa
● High temperature cycling capability
● High reliability in active power cycling
● Low interconnection resistance

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