PCIM
Visit us at PCIM 2026! The power electronics community will meet in Nuremberg – and we will be there! We warmly invite you to visit us at PCIM from June 9–11.Experience our latest innovations and connect directly with our experts...
Winner of the TIE Award 2022
NanoWired is 2022 Winner TIE Award The Tech Innovation Excellence Award (“TIE Award”), underneath the “Taiwan Innotech Expo”, is a contest organized by Taiwanese government, including the National Science and Technology Council (NSTC), the Ministry of Economic Affairs (MOEA) and...
Winner of the Falling Walls Venture Award 2020
NanoWired is 2020 Winner Falling Walls Venture As a spin-off of Technical University of Darmstadt NanoWired GmbH was founded in 2017. Based on over 30 patent submissions, NanoWired has developed four new assembly and connection technologies: NanoWiring, KlettWelding, KlettSintering, KlettGlueing. The core...
Winner of the Hermes Award 2019
NanoWired is 2019 Winner Hermes Award NanoWired GmbH, Gernsheim (Germany): Nanowired has been nominated for its “KlettWelding Tape” solution – a world-first process in which specially treated electronic components can be connected together at room temperature. The connection process is fast,...
Winner of the STEP Award 2018
NanoWired GmbH received the "Science Industry Prize".
Die Attach / Substrate Attach
ASSEMBLY PROCESS
ADVANCED TECHNOLOGY
0 sec
Fast Process
0°C
Low Temperature Process
0 MPa
Die Shear Strength
Fast Process
● Process could be done under 1 minute
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
● No Drying
● No Cleaning
Filling Up Irregularities
NanoWired compensates for irregularities of substrate surfaces
Excellent Bond Properties
● Die shear strength 50 MPa
● High temperature cycling capability
● High reliability in active power cycling
● Low interconnection resistance
● High temperature cycling capability
● High reliability in active power cycling
● Low interconnection resistance
