Die Attach / Substrate Attach
ASSEMBLY PROCESS
ADVANCED TECHNOLOGY
0 sec
Fast Process
0°C
Low Temperature Process
0 MPa
Die Shear Strength
Fast Process
● Process could be done under 1 minute
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
● No Drying
● No Cleaning
Filling Up Irregularities
NanoWired compensates for irregularities of substrate surfaces
Excellent Bond Properties
● Die shear strength 50 MPa
● High temperature cycling capability
● High reliability in active power cycling
● Low interconnection resistance
● High temperature cycling capability
● High reliability in active power cycling
● Low interconnection resistance
