Power Module
ASSEMBLY PROCESS - METHOD 1
NanoWiring on Wafer
NanoWiring on FPC
Cleaning DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
ASSEMBLY PROCESS - METHOD 2
Wafer Cleaning
NanoWiring on FPC
NanoWiring on DBC
Die Pick and Place
FPC Pick and Place
KlettSintering
ADVANCED TECHNOLOGY
0 min
Offline: NanoWiring
0 s
Inline: Pick and Place
<0 sec
KlettSintering at 180°C
Fast Process
● Single Step Assembly
● KlettWelding Tape available as Preform
● KlettWelding Tape available as Preform
Easy Process
● No Printing/Dispensing
● No Drying
● No Cleaning
● No Drying
● No Cleaning
No CTE Mismatch
DCB Copper and Interconnection copper have same CTE
No Silver Migration
Copper has no electromigration issue
