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KlettSintering

Robust substrates, strong connection
Most cost-effective method
Only one surfaces have a NanoWiring structure
Shear strength up to 60 MPa
Significantly higher tensile strength than KlettWelding
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KLETTSINTERING PROCESS

How We Manufacture KlettSintering

Structuring
Coating

One surface has a NanoWiring structure

Positioning
Compressing

From 170°C
Pressure from 10 MPa
Time from 10 s

KLETTSINTERING OVERVIEW

KlettSintering Applications

Automotive busbar Power transport by car/plane/truck
Housing technology
Power Electronics / Die Attach
Contact link
Ceramics on metal (e.g. sensors)

KlettSintering Video Tutorial

Watch video about KlettSintering presented by our CEO

KLETTSINTERING+ PROCESS

KlettSintering+

Minimum preparation effort
No surface has NanoWiring structure
Use of KlettWelding Tape
High-strength, repairable

KlettSintering+ Applications

Highest flexibility application
High current busbars
3D electronics

How We Manufacture KlettSintering+

Structuring
Coating

No surface has NanoWiring structure

Positioning
Compressing

From 170°C
Pressure from 10 MPa
Time from 120 s

Comparison of NanoWired connection technologies

The following tables shows the comparison between KlettSintering and KlettSintering+ connection technologies.

KlettSintering
KlettSintering+
NanoWiring
One Side
KlettWelding Tape
Process Temperature (°C)
170...240
170...240
Process Pressure (MPa)
10...30
10...30
Process Time (s)
120...300
120...300
Shear Strength (MPa)
20...50
30...60
Main Advantage
High shear strength
Very fine pitch
Only one NW level
No NW stage
High shear strength
Typical Application
Die Attach
Flip Chip
Die Attach
Flip Chip
High current busbar

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