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Efficient Connecting

The most efficient connecting technology

Break-through Value

Strong value propositions for advanced electronics

Award-Winning

Germany-based innovation leader

Metallic Bonding

Bond any metallic or metallized surface

50+ Patents

Proven IP and technological leadership

Global Tech Centers

Technology centers in Europe and Asia

NanoWired Connection Technologies

We research and develop substitution of solder, silver/copper sintering, TLPS, brazing, thermal connections, busbars.

NanoWiring is a galvanic process similar to pad printing. It is possible to produce the nanowires from practically all metals that can be galvanically deposited (copper, gold, silver, nickel, etc.).
In KlettWelding, two substrates prepared by NanoWiring are joined by pressing them together at room temperature. The obtained bond has superior electrical and thermal characteristics.
KlettSintering connects two substrates, only one of which has been prepared using NanoWiring. KlettSintering achieves significantly higher tensile and shear strengths than KlettWelding.
KlettGlueing connects two substrates where only one surface has a NanoWiring structure. An adhesive is applied adhesive at low pressure and low temperature, ideal for sensitive devices.
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NanoWired High Performance Applications

3D Packaging
3D Packaging
Die/Substrate Attach
Die/Substrate Attach
Wire Bonding Replacement / FPC
Wire Bonding Replacement / FPC
Complete Power Module Solutions
Complete Power Module Solutions
TIM
TIM
And More
And More

NanoWired presents the unique, patented NanoWiring Cube!

Original NanoWiring in your facility!

Leadframe
Automated Process

Leadframe

Discover all applications
Wafer
Automated Process

Wafer

Discover all applications
DBC/PCB
Automated Process

DBC/PCB

Discover all applications
ADVANCED TECHNOLOGY

Discover a Way to Manufacture
200°C Power Module

No Printing or Dispensing.
No Drying or Cleaning.
Low temperature process.
No CTE mismatch.
Top and bottom interconnection in one step.
Explore Technology

Board of Directors

NANOWIRED MANAGEMENT

Sebastian Quednau
Sebastian Quednau
Co-CEO/CTO

Dr.-Ing. Electrical Engineering
Co-Founder

Farough Roustaie
Farough Roustaie
Co-CEO/CSO

Dr.-Ing. Microsystem Technology
Co-Founder

Florian Weissenborn
Florian Weissenborn
Co-CEO/COO

Diploma in Electrical Engineering
Co-Founder

About NanoWired!

News and updates

PCIM

Winner of the TIE Award 2022

Winner of the Falling Walls Venture Award 2020

More Info

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