NanoWiring is a electroplating process similar to tampon printing. For this, an in electrolyte soaked sponge is being pressed onto the substrate. The metallic lawn grows through the pores of the sponge. Through a patterning process (masking), only predefined areas on the substrate are covered with nanowires. Finally, in a stripping-process all materials, not needed for the connection, are removed and the substrate is cleaned.

The electroplating process makes it practically possible to produce the nanowires from all precipitable.

Next step:

KlettWelding (Connection at Room Temperature)

KlettSintering (Connection with One-Sided Coating)

Wire materialCopper, gold, nickel, silver, platinum, tin
NanoWiring-Diameter30 nm to 2 µm (typically 1 µm)
NanoWiring-length500 nm to 50 µm (typically 10 µm / 25 µm / 50 µm)
Substrate MaterialsCopper, aluminum, stainless steel, gold, ceramics (including LTTC), polymer (PI, PCB), glass