Connection with One-Sided Coating

KlettSintering only requires a NanoWiring for one of the two substrates to be connected

The KlettSintering basically connects two substrates, which only requires NanoWiring for one of the two substrates. This process is similar to the modified bonding process which uses our KlettWelding tape. For this process, the substrates to be connected need only to have copper or gold surfaces. In KlettSintering a temperature of about 210°C must be applied in the contact area while the substrates are pressed together (for example with 20 MPa) for 2 minutes.
The KlettSintering achieves similar tensile and shear strengths as the KlettWelding. Especially This process is advantageous in applications like connecting temperature sensors.

Step Back: NanoWiring (Coating)



KlettWelding Tape

The KlettWelding tape is a universal product that can be applied in two basic ways.
First, to extend the height of NanoWiring hairs. This is advantageous for very robust applications. Also, thicker connection heights can be achieved. This is particularly advantageous when substrates with two different expansion coefficients must be connected.
On the other hand, the KlettWelding Tape can also be used for KlettSintering process. This has the advantage that substrates to be connected do not need to go through NanoWiring step. By simply pressing together, a double-sided Klettsintering process takes place at 210 °C.





Properties of the connection : 




necessary bonding pressure

1 – 70 MPa (typically 20 MPa)

Shear strength

up to ca. 30 MPa (typically 12 MPa)

Tensile strength

up to ca. 20 MPa (typically 12 MPa)

KlettWelding temperature

From room temperature

Bonding time

60 ms to 60 s

Temperature tolerance


Contact electrical resistance

< 1 µΩ/mm²

Thermal conductivity

350 W/m⋅K

Planarity requirements

Approx. 1/2 length of NanoWiring

Wire material

Copper Gold

Substrate Materials

Copper, aluminum, stainless steel, gold, ceramics (including LTTC), polymer (PI, PCB), glass