Comparison of NanoWired connection technologies

 KlettWeldingKlettWelding+KlettSinteringKlettSintering+KlettGlueingKlettGlueing+
NanoWiring (NW)both sidesboth sidesone pagesVelcro Welding Tapeone sideVelcro Welding Tape
Temperature [°C]20170 – 240170 – 240170 – 24020 – 150120 – 1501
Pressure [MPa]15 – 20015 – 10010 – 10010 – 1001 – 51 – 5
Time [s]0,06 – 60120 – 300120 – 300120 – 3000,06 – 3000,06 – 300
Adhesive/Unterfüllungoptionaloptionaloptionalrequiredrequired
Shear strength [MPa] 6- 2020-6520-5520-50≈ 20 MPa1≈ 20 MPa1
Main advantage - Low temperature
- Very fast
- Very fine pitch
- Very high
Shear strength
- Very fine pitch
- High shear strength
- Only one NW level
- Very fine pitch
- High shear strength - No NW stage - Low temperature
- Low pressure
- Only one NW level
- Very fine pitch
- Low temperature
- Low pressure
- No NW Level
Typical application - The Attach
- Temperature sensitive devices
- Flip Chip
- The Attach
- Flip Chip
- High Current Busbars
- The Attach
- Flip Chip
- High Current Busbars
- The Attach
- PCB to FPC
- Temperature sensitive devices
- Prototypes
- Repair of connecting lines
[1] Depending on the adhesive used. Structalit 8202 with a curing temperature of 110° C is approved.

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