In principle, KlettSintering connects two substrates, only one of which has been prepared using NanoWiring. A variation of the process is the use of our KlettWelding tape. Here, the substrates to be joined only need to have a copper-plated or gold-plated surface. When pressing together (e.g. 20 MPa), an additional temperature of approx. 210°C must be brought into the joining zone (thermode). KlettSintering achieves significantly higher tensile and shear strengths than KlettWelding. This process offers significant advantages, especially for punched grid applications or when connecting temperature sensors.
Velcro Welding Tape
The KlettWelding tape is a universal product that can be used in two basic ways. Firstly, in KlettWelding to extend the NanoWiring hair. This can be advantageous for very robust applications. It can also be used to create thicker bonding zones. This is particularly advantageous when substrates with different expansion coefficients have to be joined.
On the other hand, the KlettWelding tape can also be used for KlettSintering. This has the advantage that none of the substrates to be joined have to undergo nano-wiring beforehand. By simply pressing the tape together, a double KlettSintering process takes place at 210°C.