In KlettWelding, two substrates prepared by NanoWiring are joined by pressing them together (e.g. with 20 MPa) at room temperature. Depending on the component size, this force can be applied by commercially available pick-and-place machines or FlipChip bonders. Large area connections are made with electric motor or hydraulic power machines. The use of simple toggle presses is also possible. Even after storage of more than one year, the high-performance KlettWelding connection can be produced without any problems using KlettWelding activator. In the field of very robust applications, an additional KlettWelding tape can be used to thicken the joint zone, like an artificial hair extension.
Due to their small diameter, the individual wires join instantaneously mechanically and additionally on the atomic lattice level - similar to cold welding. The resulting bond has electrical and thermal characteristics comparable to rolled copper, while maintaining high mechanical strength. The video below shows the hook-and-loop welding process of a silicon chip with copper pillars, carried out with a FlipChip bonder.