Author: rene.bernst

Meet us at SEMICON / productronica

We will be at SEMICON/productronica again this year from 16.11.2021 - 19.11.2021! Visit us, take part in exciting lectures and get to know our technology with our innovative NanoWiring Cube up close! You will find us in Hall B2.332/1. As the world's leading trade fair for the development and production of electronics, productronica 2019 offered its visitors a lot of new things: World premieres and products,...
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NanoWired at the 14th Bondexpo

This year you will find NanoWired from 05.10.2021 - 08.10.2021 at the Bondexpo (Motek) in Hall 5, Stand 304. Motek is the world's leading trade fair for automation and, together with the parallel Bondexpo, the international trade fair for adhesive bonding technology, forms a powerful trade fair alliance that offers an ideal platform for future topics such as NanoWiring....
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The cooperation with YESvGaN

Through cooperative collaboration with NanoWired GmbH and other partners, the YESvGaN project is making great strides in microelectronics. NanoWired GmbH is not only contributing with its own technology, it is also conducting research in the project in close collaboration. "YESvGaN will establish a new class of vertical GaN power transistors that will exploit the performance advantages of...
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Summit meeting of the world market leaders

Once a year, the hidden champions meet for the summit meeting of the world market leaders. Due to the corona pandemic in 2021 digital. With our CEO Olav Birlem, NanoWired GmbH enters the discussion on current topics such as climate change, the corona crisis, artificial intelligence or the exchange of blows between the USA and China. What can we learn from abroad? Where...
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Tagesspiegel Interview with Olav Birlem

"The creation of nano-wiring structures is actually a well-known technology," says Olav Birlem. Research was already being done on this worldwide 20 years ago. However, the technique could only be applied to an area the size of a postage stamp. "However, we have managed to grow the hairs on 300 by 300 millimetres within half an hour and thus create the connection between the...
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Taishi Industrial promotes 3D nanoarchitecture to solve hybrid bonding and heat treatment problems

Currently, it is determined to use this nanowire metal as a high-precision connection microstructure (interconnection). Due to the quantum mechanical effect of the nanostructure, the length, angle and line width of the nanowire are precisely controlled. Different combination specifications can change the physical properties of the metal and create a new technology for joining two pieces of metal at normal temperature to replace the traditional high-temperature soldering process....
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Winner of the German Innovation Award 2020

NanoWired is making the next performance push in electronics with its novel interconnection technologies. Three basic processes have been developed: NanoWiring, KlettWelding, KlettSintering. Based on metallic nanorases on any surface (NanoWiring), a highly conductive, permanently solid metallic 0Ω connection is created at low temperature (KlettWelding, KlettSintering). In this way, it is possible to realise the current and future development needs in microelectronics, which...
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