Underfill can be applied directly to the nanowires

Underfill can be applied directly to the nanowires

NanoWired makes it possible to produce copper bumps on which the nanowires grow. These bumps realise a defined distance between component and substrate. Thus, underfill materials can be used. VelcroWelding with underfill, which takes place by displacement, offers a large area of mechanical connection of components to the substrate.

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