A variety of materials can be used for NanoWiring

A variety of materials can be used for NanoWiring

KlettWelding - Properties

The nanowires for our mechanically, thermally and electrically extremely conductive connection can be made from almost all metals that can be deposited by electroplating. However, copper, gold, nickel, silver and platinum have proven themselves. Suitable substrate materials include ceramics (LTTC), polymers (PI, PCB), glass, semiconductor material, aluminum, steel, copper and many more.

In the case of a PCB, FPC, wafer or leadframe, one has many contact zones that are not connected to each other for the time being. For the electroplating process, the entire surface is covered with a continuous metal layer (for example by a sputter process). The next step is to mask and form the NanoWiring structure into the porosity layer. This porosity layer is removed after NanoWiring by stripping. This is a type of cleaning process that ensures that the NanoWiring only exists at the intended contact points and that all foreign materials are dissolved. Stripping can be performed wet-chemically or by plasma.

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