The "copper velcro" for efficient electronics production

The "copper velcro" for efficient electronics production

Welcome to the first of seven posts in our "How does NanoWiring work?" post series.

It might sound confusing for some to associate a Velcro fastener with highly efficient and advanced nanotechnology. Nevertheless, we, the NanoWired have created a milestone in nanotechnology and in the connection of electronic and mechanical components with the KlettWelding tape. Therefore, we want to let the beauty of this technology blossom once again in a short series.

Before the e.g. copper KlettWelding-Tape grows its metallic "hairs" via an electroplating process, the foil substrate is subjected to a cleaning process. Then we apply a special sponge-like material to the surface. The special feature: There is a special porosity layer on the substrate side, which is filled with the metal, such as copper, in the subsequent galvanic process. It should be mentioned here that any surface and any substrate that can be metallised is suitable for NanoWiring. It does not matter whether the base material consists of metal, ceramics, glass, plastic, semiconductor materials or other substances. The only requirement is that the surface can be electrically contacted and that the side facing the electroplating process is metallised with copper, silver, gold or nickel. Since a few nanometres of layer thickness are sufficient, this can be achieved by sputtering or pre-galvanisation or metal vapour processes.

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