Our technology substitutes all thermal interface materials (abbreviated TIM). The KlettWelding tape is inserted between two components to improve the thermal coupling between them.


Our technology makes it possible to conduct electricity without the joint heating up as with soldering, and this with an electrical resistance of <1µOhm/mm².


Our technology offers a state-of-the-art solution for the precise joining of small and sensitive surfaces, at high speed and with the highest accuracy.




NanoWired GmbH presents the NanoWiring Cube!

An automatic production machine that allows you to process any metallic or metallised surface with our NanoWiring process.

Possible applications

NanoWired offers the most efficient alternative for connecting your technology!

We bond any metallic or metallised surface!

Our technology is classically used in applications such as busbars, power modules, heat sinks, silicon wafers, flip chips or micro controllers.

Our technology   

The alternative connection type

to the parameters

The metallic Velcro fastener

to the parameters

Robust substrates, strong connection

to the parameters

The connection for sensitive parts

to the parameters

Book an online event and get to know us!


Connection at room temperature

► KlettWelding bonds all metallic/metallised surfaces at room temperature in milliseconds C02-free
► No thermal stress, no soldering

Electrical and thermal conductivity

► Higher conductivities than soldering, bonding, gluing or screwing
► Cost down due to lower material consumption
► Saving silicon and material thicknesses

Long-term stability

► No embrittlement of the connection, no battery voltages
► Also for areas >> 1cm²
► Safe compliance with modern safety standards (3000 shock cycles)

3D packaging

► Reduced space consumption through direct stacking of semiconductor components
Ideal for chiplet technology

No heavy metals

► No harmful heavy metals
► Copper recycling is a standard process

High temperature resistant

► High temperature resistant of over 500°C
Ideal application = TIM for power electronics


Underfill can be applied directly to the nanowires

NanoWired makes it possible to produce copper bumps on which the nanowires grow. These bumps realise a defined distance between component and substrate. Thus, underfill materials can be used. KlettWelding with[...]

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A variety of materials can be used for NanoWiring

The nanowires for our mechanically, thermally and electrically extremely conductive connection can be made from almost all metals that can be galvanically deposited. However, copper, gold, nickel, silver and[...]

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Masking with standard lithography or other masking processes

Welcome to the second of seven posts in our "How does NanoWiring work?" post series. Not every surface should be fully contacted. The standard is not just single but hundreds or[...]

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Our Team

NanoWired GmbH. More than just a company!

We need space! With our location in Gernsheim, we have a total of over 800 sqm at our disposal. They are currently occupied with office and laboratory space, as well as our own clean rooms in the ISO5 - ISO10 range.

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