Typical areas of application

THERMAL INTERFACE MATERIAL

Our technology substitutes all thermal interface materials (abbreviated TIM). The KlettWelding tape is inserted between two components to improve the thermal coupling between them.

POWER APPLICATION

Our technology makes it possible to conduct electricity without the joint heating up as with soldering, and this with an electrical resistance of <1µOhm/mm².

FINE PITCH

Our technology offers a state-of-the-art solution for the precise joining of small and sensitive surfaces, at high speed and with the highest accuracy.

HEAT EFFICIENCY

ELECTRICAL RESISTANCE

PRECISION

NanoWired GmbH presents the NanoWiring Cube!

An automatic production machine that allows you to process any metallic or metallised surface with our NanoWiring process.

Possible applications

NanoWired offers the most efficient alternative for connecting your technology!

We bond any metallic or metallised surface!

Our technology is classically used in applications such as busbars, power modules, heat sinks, silicon wafers, flip chips or micro controllers.

Our technology   

The alternative connection type

to the parameters

The metallic Velcro fastener

to the parameters

Robust substrates, strong connection

to the parameters

The connection for sensitive parts

to the parameters

Arrange a non-binding consultation appointment immediately!

ADVANTAGES FOR YOUR PRODUCT

Connection at room temperature

► KlettWelding bonds all metallic/metallised surfaces at room temperature in milliseconds C02-free
► No thermal stress, no soldering

Electrical and thermal conductivity

► Higher conductivities than soldering, bonding, gluing or screwing
► Cost down due to lower material consumption
► Saving silicon and material thicknesses

Long-term stability

► No embrittlement of the connection, no battery voltages
► Also for areas >> 1cm²
► Safe compliance with modern safety standards (3000 shock cycles)

3D packaging

► Reduced space consumption through direct stacking of semiconductor components
Ideal for chiplet technology

No heavy metals

► No harmful heavy metals
► Copper recycling is a standard process

High temperature resistant

► High temperature resistant of over 500°C
Ideal application = TIM for power electronics

News

Meet us at SEMICON / productronica

We will be at SEMICON/productronica again this year from 16.11.2021 - 19.11.2021! Visit us, take part in exciting presentations and get to know our technology with our innovative NanoWiring Cube up close! You[...]

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NanoWired at the 14th Bondexpo

International Trade Fair for Adhesive Bonding Technology This year you will find NanoWired from 05.10.2021 - 08.10.2021 at Bondexpo (Motek) in Hall 5, Stand 304. Motek is the world's leading trade fair for automation[...]

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The cooperation with YESvGaN

Through cooperative collaboration with NanoWired GmbH and other partners, the YESvGaN project is achieving great progress in microelectronics. NanoWired GmbH is not only making its contribution with its[...]

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Our Team

NanoWired GmbH. More than just a company!

We need space! With our location in Gernsheim, we have a total of over 800 sqm at our disposal. They are currently occupied with office and laboratory space, as well as our own clean rooms in the ISO5 - ISO10 range.

Look behind the scenes
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