Winner 2020 in the category Materials & Services in Business to Business. The German Innovation Award honors products and solutions across all industries that differRead more
By KlettWelding two surfaces prepared with NanoWiring are joined together at room temperature. The process not only removes the reflow process and protects the semiconductor components, but is also applicable to polymer films.
The purely metallic interconnection of e.g. copper, gold or nickel has significantly higher electrical and thermal conductivities than any soldered, bonded, glued, screwed or welded joint.
Using just one type of metal to make the interconnections instead of using alloys or metallic compounds prevents embrittlement of the interconnection as a result of temperature cycling.
In KlettWelding and Klettsintering, the bonding process takes place in the z-axis. NanoWiring both sides also lets substrates to be stacked on top of eachother. This reduces the saves space on the surface and enables the fabrication of 3D hybrid structures.
Replacing gold with copper eliminates the polluting gold recycling processes. Also, No heavy or rare-earth metals are used in the interconnections.
After bonding, the connections are resistant to high temperatures greater than 600 ° C. Thus, a direct thermal connection, needing no additives, is possible.
7 years of research at the Technical University of Darmstadt combined with many years of industrial management experience laid the foundation stone of NanoWired GmbH.Read more