By KlettWelding two surfaces prepared with NanoWiring are joined together at room temperature. The process not only removes the reflow process and protects the semiconductor components, but is also applicable to polymer films.
The purely metallic interconnection of e.g. copper, gold or nickel has significantly higher electrical and thermal conductivities than any soldered, bonded, glued, screwed or welded joint.
Using just one type of metal to make the interconnections instead of using alloys or metallic compounds prevents embrittlement of the interconnection as a result of temperature cycling.
In KlettWelding and Klettsintering, the bonding process takes place in the z-axis. NanoWiring both sides also lets substrates to be stacked on top of eachother. This reduces the saves space on the surface and enables the fabrication of 3D hybrid structures.
Replacing gold with copper eliminates the polluting gold recycling processes. Also, No heavy or rare-earth metals are used in the interconnections.
After bonding, the connections are resistant to high temperatures greater than 600 ° C. Thus, a direct thermal connection, needing no additives, is possible.
The NanoWirinng is the basis of our connection technology. At this step a metallic lawn will be grown on almost any surface through an active galvanic process. Each hair typically has a length of 25 μm and a diameter of 1 μm. Based on the Nanowiring technology there are two two technologies are available can be used for connecting two surfaces. The KlettWelding connects instantaneously two substrates prepared with NanoWiring at room temperature by only compression. In contrast to KlettWelding, KlettSintering only requires NanoWiring for just one of the two substrates to be connected. For this reason, KlettSintering requires a temperature of 210°C in addition to pressing together for 2 minutes. The resulting connection properties are identical with KlettWelding. By using our KlettWelding-Tape even no surface needs to be prepared with NanoWiring. For quality control, a special procedure - NanoInspection - has been developed.
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