NanoWired wins HERMES AWARD 2019

Press release

KlettWelding connects...Shop now!

Shop

THE ADVANTAGES AT A GLANCE

Joining at room temperature

By KlettWelding two surfaces prepared with NanoWiring are joined together at room temperature. The process not only removes the reflow process and protects the semiconductor components, but is also applicable to polymer films.

Joining at room temperature
High electrical and thermal conductivity

The purely metallic interconnection of e.g. copper, gold or nickel has significantly higher electrical and thermal conductivities than any soldered, bonded, glued, screwed or welded joint.

High electrical and thermal conductivity
Improved long-term stability

Using just one type of metal to make the interconnections instead of using alloys or metallic compounds prevents embrittlement of the interconnection as a result of temperature cycling.

Improved long-term stability
Enables 3D packaging

In KlettWelding and Klettsintering, the bonding process takes place in the z-axis. NanoWiring both sides also lets substrates to be stacked on top of eachother. This reduces the saves space on the surface and enables the fabrication of 3D hybrid structures.

Enables 3D packaging
No heavy metals

Replacing gold with copper eliminates the polluting gold recycling processes. Also, No heavy or rare-earth metals are used in the interconnections.

No heavy metals
High temperature resistant

After bonding, the connections are resistant to high temperatures greater than 600 ° C. Thus, a direct thermal connection, needing no additives, is possible.

High temperature resistant

THE TECHNOLOGY

The NanoWirinng is the basis of our connection technology. At this step a metallic lawn will be grown on almost any surface through an active galvanic process. Each hair typically has a length of 25 μm and a diameter of 1 μm. Based on the Nanowiring technology there are two two technologies are available can be used for connecting two surfaces. The KlettWelding connects instantaneously two substrates prepared with NanoWiring at room temperature by only compression. In contrast to KlettWelding, KlettSintering only requires NanoWiring for just one of the two substrates to be connected. For this reason, KlettSintering requires a temperature of 210°C in addition to pressing together for 2 minutes. The resulting connection properties are identical with KlettWelding. By using our KlettWelding-Tape even no surface needs to be prepared with NanoWiring. For quality control, a special procedure - NanoInspection - has been developed.

THE TECHNOLOGY
Coating
Coating

NanoWiring is a electroplating process similar to tampon printing. For this, an in electrolyte soaked sponge is being pressed onto the substrate. The metallic lawnRead more

Connection at Room Temperature
Connection at Room Temperature

With KlettWelding, two substrates prepared with NanoWiring are instantaneously joined together by compression (e.g., 20 MPa) at room temperature. The needed pressure and force correlatesRead more

Connection with One-Sided Coating
Connection with One-Sided Coating

KlettSintering only requires a NanoWiring for one of the two substrates to be connected The KlettSintering basically connects two substrates, which only requires NanoWiring forRead more

Quality Control
Quality Control

Immediately following the NanoWiring, the “buried” areas are examined for homogeneity and any defects.For this purpose, a combination of different optical methods is used. ARead more

When do you connect with us?

Contact

The company

Team

Team

7 years of research at the Technical University of Darmstadt combined with many years of industrial management experience laid the foundation stone of NanoWired GmbH.Read more

Our Location in Gernsheim

Our Location in Gernsheim

We need space! That’s why we’re in the middle of moving to our new location in Gernsheim. The whole 800 square meters area consists ofRead more