The nanowires for our mechanically, thermally and electrically extremely conductive connection can be made from almost all metals that can be galvanically deposited. However, copper, gold, nickel, silver and platinum have proven themselves. Suitable substrate materials include ceramics (LTTC), polymers (PI, PCB), glass, semiconductor material, aluminium, steel, copper and many more.
With a PCB, FPC, wafer or leadframe, you have many contact zones that are not connected to each other for the time being. For the electroplating process, the entire surface is covered with a continuous metal layer (for example by a sputtering process). In the next step, the masking and the formation of the NanoWiring structure into the porosity layer takes place. This porosity layer is removed after NanoWiring by stripping. This is a kind of cleaning process that ensures that the NanoWiring only exists at the intended contact points and that all foreign materials are dissolved. The stripping can be done wet-chemically or by plasma.
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